top of page

Journal papers


[J142] T.T. Hoang,† A. M. Cunio,† S. Zhao, T.-V. Nguyen, S. Peng, S. Liaw, T. Barber, J. Zhang, S. Farajikhah, F. Dehghani, T.N. Do,* H.-P. Phan,* Flexible, wearable mechano-acoustic sensors for real-time, wireless monitoring of low frequency body sounds, Advanced Sensor Research, Accepted 2024. 


[J141] X. Lin, A. Vasanth, A. Ashok, H.-P. Phan, K.M. Koo, M.A. Amin, Y.V. Kaneti, C. Salomon, Md S.A. Hossain,* Y. Yamauchi, M. K. Masud*, Nanoarchitectonics of Point-of-Care Diagnostics for Sweat Biomarkers Analysis , Nano Material Science, Accepted, 2024. (IF: 9.9)

[J140] Y. Park, H. Luan, K. Kwon, T.S Chung, S. Oh, J.-Y. Yoo, G. Chung, J. Kim, S. Kim, S.S. Kwak, J. Choi, H.-P. Phan, S. Yoo, H. Jeong, J. Shin, S.M. Won, H.-J. Yoon, Y.H. Jung, J.A. Rogers, Soft, full Wheatstone bridge 3D pressure sensors for cardiovascular monitoring, NPJ Flexible Electronics, Accepted, 2024. (IF: 12.74)

[J139] Y. Qiu, A. Ashok, C.C. Nguyen, Y. Yamauchi, T.N. Do, H.-P. Phan*, Integrated Sensors for Soft Medical Robotics, Small, Accepted. (IF: 13.3) [Link]

[138] T. Dinh, M. Rais-Zadeh, T. Nguyen, H.-P. Phan, P. Song, R. Deo, D. Dao, N.-T. Nguyen, J. Bell, Micromachined Mechanical Resonant Sensors: From Materials, Structural Designs to Applications, Advanced Material Technologies, Accepted. [Link]  (IF: 5.4)

[J137] D.V. Nguyen, D. Mills, C.-D. Tran, T. Nguyen, H. Nguyen, T.L. Tran, P. Song, H.-P. Phan, N.-T. Nguyen, D.V. Dao, J. Bell, T. Dinh, Facile Fabrication of “Tacky”, Stretchable, Aligned Carbon Nanotube Sheet-Based Electronics for On-Skin Health Monitoring, ACS Applied Materials & Interfaces, Accepted. (IF: 9.5)


[J136] P. T. Phan,  J. Davies, T. T. Hoang, M. T. Thai, C. C. Nguyen,  A. Ji, K. Zhu, B. Sharma, E. Nicotra, C. Hayward, H.-P. Phan, N. H. Lovell, T. N. Do, "Robotic Cardiac Compression Device Using Artificial Muscle Filaments for the Treatment of Heart Failure", Advanced Intelligent Systems, Accepted, 2023. [Link]

[J135] K. Zhu, P. T. Phan, B. Sharma, J. Davies, M. T. Thai, T. T. Hoang, C. C. Nguyen,  A. Ji,  E. Nicotra, T.T. Vo-Doan, H.-P. Phan, N. H. Lovell, T. N. Do, Smart Textile-Driven Soft Exosuit for Spinal Assistance, Sensors,  23(19), 8329, 2023. [Link]

[J133] M.T. Thai et al.,  Soft Wearable Haptic Display and Flexible 3D Force Sensor for Teleoperated Surgical Systems, Advanced Sensors Research, Accepted 2023. [Link]

[J132] A. Ashok, A. Vasanth, T. Nagaura, C. Setter, J.K. Clegg, A. Fink, M.K. Masud, Md. Hossain, T. Hamada, M. Eguchi, H.-P. Phan,* Y. Yamauchi,*  Mesoporous Metastable CuTe2 Semiconductor, Journal of the American Chemical Society (JACS), Accepted 2023. (* Corresponding author)  (IF: 15) [Link]

[J131] H. Nguyen, T. Nguyen, D.V. Nguyen, H.-P. Phan, T.-K. Nguyen, D.V. Dao, N.-T. Nguyen, J. Bell, T. Dinh, Enhanced photovoltaic effect in n-3C-SiC/p-Si heterostructure using a temperature gradient for microsensors, ACS Applied Materials & Interfaces, Accepted 2023. (IF: 9.5)

[J130] P. T. Phan, D. Welch, J. Spiggle, M. T. Thai, T. T. Hoang, J. Davies, C. C. Nguyen, K. Zhu, H.-P. Phan, N. H. Lovell, T. N. Do, Fabrication, nonlinear modeling, and control of woven hydraulic artificial muscles for wearable applications, Sensors & Actuator A: Physics, Accepted 2023. 

[J129] S. Zhao, C.C. Nguyen, T.T. Hoang, T.N. Do, H.-P. Phan, Transparent pneumatic tactile sensors for soft biomedical robotics, Sensors, 23(12), 5671, 2023. [Link] (IF: 3.847)

[J128] T.-H. Vu, S. Yadav, C.-D. Tran, H.-Q. Nguyen, T.-H. Nguyen, T. Nguyen, T.-K. Nguyen, J. Fastier-Wooller, T. Dinh, H.-P Phan, H. Ta, N.-T. Nguyen, D. Dao, V. T.  Dau, Charge-reduced particles via self-propelled electrohydrodynamic atomisation for drug delivery applications, ACS Applied Materials & Interfaces, 15, 25, 29777–29788, 2023.  (IF: 10.383) [Link]

[127] C. C. Nguyen,  T. Teh, M. T. Thai, P. T. Phan,  T. T. Hoang, J. Davies, H.-P. Phan, C. H. Wang, N. H. Lovell, T. N. Do, A Handheld Hydraulic Soft Robotic Device with Bidirectional Bending End-Effector for Minimally Invasive Surgery, IEEE Transactions on Medical Robotics and Bionics, 5(3), 590, 2023. [Link

[J126] C. C. Nguyen,   M. T. Thai, T. T. Hoang, J. Davies, P. T. Phan, K. Zhu, L. Wu, M. A. Brodie, D. Tsai, Q. P. Ha, H.-P. Phan, N. H. Lovell, T. N. Do, Design and Fabrication of a Novel Cardiac Ablation Catheter with Variable Stiffness Stabilizing Mechanism and Soft Sensor, Sensors and Actuators A,  357, 114380, 2023. [Link] (IF: 4.291)

[J125] T.-A. Truong, T.-K. Nguyen, X. Huang, A. Ashok, S. Yadav, Y. Park, M.T. Thai, N.-K. Nguyen, H. Fallahi, S. Peng, S. Dimitrijev, Y.-C. Toh, Y. Yamauchi, C.H. Wang, N.H. Lovell, J.A. Rogers, T.N. Do, N.-T. Nguyen, H. Zhao, H.-P. Phan, Engineering route for stretchable, three-dimensional microarchitectures of wide bandgap semiconductors for biomedical applications, Advanced Functional Materials, 33, 2211781, 2023. (IF: 19.92) [Link] Inside Back Cover 

[J124] M.T. Thai, P.T. Phan, H.A. Tran, C.C. Nguyen, T.T. Hoang, J. Davies, J. Rnjak-Kovacina, H.-P. Phan, N.H. Lovell, T.N. Do, Advanced Soft Robotic System for In Situ 3D Bioprinting and Endoscopic Surgery, Advanced Science, 10(12), e2205656, 2023. (IF: 17.52) [Link]


[J123] C.C. Nguyen, S. Wong, M.T. Thai, T.T. Hoang, P.T. Phan, J. Davies, L. Wu, D. Tsai, H.-P. Phan,* N.H. Lovell, T.N. Do,* Advanced User Interfaces for Teleoperated Surgical Robotic Systems, Advanced Sensor Research, 2, 2200036, 2023. (Invited review paper) [Link] ​(Corresponding Author)

[J122] J. Davies, M.T. Thai, T.T. Hoang, C.C. Nguyen, P.T. Phan, H.-P. Phan, N.H. Lovell, T.N. Do, A Stretchable Filament Sensor with Tunable Sensitivity for Wearable Robotics and Healthcare Applications, Advanced Materials Technologies, 2023. Accepted (IF: 8.856) [Link] Inside Front Cover 

[J121] A. Ashok,§ T.-K. Nguyen,§ M. Barton, M. Leitch, M.K. Masud, H. Park, T.A. Truong, Y.V. Kaneti, H.T. Ta, X. Li, K. Liang, T.N. Do, C.-H. Wang, N.-T. Nguyen, Y. Yamauchi, H.-P. Phan, Flexible Nanoarchitectonics for Biosensing and Physiological Monitoring Applications, Small, 19, 2204946, 2023. (IF: 15.15) Inside Front Cover [Link]


[J120] T.S.D. Le, H.-P. Phan, S. Kwon, S. Park, Y. Jung, J. Min, B.J. Chun, H. Yoon, S.H. Ko, S.-W. Kim, Y.-J. Kim, Recent Advances in Laser-Induced Graphene: Mechanism, Fabrication, Properties, and Applications in Flexible Electronics, Advanced Functional Materials, 32(48), 2205158, 2022.  (IF: 19.92) [LinkBack Cover

[J119] T.T. Hoang, P.T. Phan, M.T. Thai, J. Davies, C.C. Nguyen, H.-P. Phan, N.H. Lovell, T.N. Do, Magnetically engineered conductivity of soft liquid metal composites for robotic, wearable electronic, and medical applications, Advanced Intelligent Systems, 4, 2200282, 2022.  (IF: 7.298) Inside Front Cover [Link]

[J118] T.-K. Nguyen, M. Barton, A. Ashok, T.-A. Truong, S. Yadav, M. Leitch, T.-V. Nguyen, N. Kashaninejad, T. Dinh, L. Hold, Y. Yamauchi, N.-T. Nguyen, H.-P. Phan, Wide bandgap semiconductor nanomembranes as a long-term bio-interface for flexible, implanted neuromodulator, Proceedings of the National Academy of Sciences USA (PNAS), 119(33), e2203287119, 2022.  [Link] (IF: 12.779)

[J117] T. Nguyen, N. S. Shagle, H. Vu, H. Nguyen, H.-P. Phan, V. Dau, P. Song, H. Wang, T. L. Anh, N.-T. Nguyen, D. Dao, T. Dinh, Stretchable, Skin-Breathable, and Ultrasensitive Respiration Sensor Using Graphite on Paper With Smart Structures, IEEE Sensors, 22(17), 16804-16810, 2022. (IF: 3.301) [Link]

[J116] P.T. Phan, M.T. Thai, T.T. Hoang, J. Davies, C.C. Nguyen, H.-P. Phan, N.H. Lovell, T.N. Do, Smart Textiles Using Fluid-Driven Artificial Muscle Fibers, Scientific Reports, 12, 11067, 2022. [Link] (IF: 4.38) 

[J115] P. Guzman, T. Dinh, A. Qamar, J.S. Lee, X. Q. Zheng, P.X.L. Feng, M. Rais-Zadeh, H.-P. Phan, T. Nguyen, A. R. Md Foisal, H. Li, N.-T. Nguyen, D. V. Dao, Thermal-piezoresistive pumping on double SiC layer resonator for effective quality factor tuning, Sensors and Actuators A, 343(16), 113678, 2022. [Link] (IF: 3.407)

[J114] T.-K. Nguyen, S. Yadav, T.-A. Truong, M. Han, M.J. Barton,  M. Leitch, P. Guzman, T. Dinh, A. Ashok, H. Vu, T.V. Dau, D. Haasmann, L. Chen, Y. Park, T.N. Do, Y. Yamauchi, J.A. Rogers, N.-T. Nguyen, H.-P. Phan, Integrated, transparent silicon carbide electronics and sensors for radio-frequency biomedical therapy, ACS Nano, 16(7), 10890–10903, 2022. [Link] (IF: 18.027)

[J113] H.-Q. Nguyen, A.R. Md Foisal, P. Tanner, T.-H. Nguyen, S. Aberoumand, V.T. Dau, T. Dinh, S. Dimitrijev, H.-P. Phan, Nam-Trung Nguyen, D.V. Dao, ACS Applied Electronics Materials, Giant Piezotronic Effect by Photoexcitation - Electronic Coupling in p-GaN/AlGaN/GaN Heterojunction, 4(6), 2648–2655, 2022. [Link] (IF: 3.314)

[J112] F. Akther, J. Zhang, H. D. N. Tran, H. Fallahi, H. Adelnia, H.-P. Phan, N.-T. Nguyen, H. T. Ta, Atherothrombosis-on-chip: a site-specific microfluidic model for thrombus formation and drug discovery, Advanced Biology, 6(7), 2101316, 2022. [Link] (IF: 3.591) Front Cover

[J111] Z.S. Nishat, T. Hossain, Md. N. Islam, H.-P. Phan, Md A. Wahab, M.A. Moni, C. Salomon, V. Kaneti, A.A.I. Sina, Md S.A. Hossain, Y. Yamauchi, M.K. Masud, Hydrogel nanoarchitectonics: an evolving paradigm for ultrasensitive Biosensing, Small, 18(26), 2107571, 2022. [Link(IF: 13.3)

[J110] N.-K. Nguyen, P. Singha, S. K. Rajan, D. T. Tran, H.-P. Phan, N.-T. Nguyen, C. H. Ooi, Controllable high-performance liquid marble micromixer, Lab on a Chip, 22, 1508-1518, 2022. [Link] (IF: 6.799)

[J109] T.-H. Vu, H. Nguyen, J. Fastier-Wooller, C.-D. Tran, T.-H. Nguyen, H.-Q. Nguyen, T. Nguyen, T.-K. Nguyen, T. Dinh, T. Bui, Y. L. Zhong, H.-P. Phan, N.-T. Nguyen, D. Dao, V. Dau, Enhanced electrohydrodynamics for electrospinning highly sensitive flexible fibre-based piezoelectric sensor, ACS Applied Electronic Materials, 4(3), 1301–1310. [Link] (IF: 3.314)

[J108] O. Cooper, H.-P. Phan, T. Fitzpatrick, T. Dinh, H. Huang, N.-T. Nguyen, J. Tiralongo, Picomolar detection of carbohydrate-lectin interactions on piezoelectrically printed microcantilever array, Biosensors and Bioelectronics, 205,  114088, 2022. [Link] (IF: 10.62)

[J107] A. Ashok, A. Vasanth, T. Nagaura, M. Eguchi, N. Motta, H.-P. Phan,* N.-T. Nguyen, J. G. Shapter, J. Na,* Y. Yamauchi,* Plasma Induced Nanocrystalline Domain Engineering and Surface Passivation in Mesoporous Chalcogenide Semiconductor Thin Films, Angewandte Chemie International Edition, 61, e202114729, 2022. (* Corresponding authors) [Link] (IF:15.34) 

[J106] T.-A. Truong, T.-K. Nguyen, H. Zhao, K. Nguyen, T. Dinh, Y. Park, T. Nguyen, Y. Yamauchi, N.-T. Nguyen, and H. P. Phan*, Engineering stress in thin films: An innovative pathway towards three-dimensional micro and nanosystems, Small, 18(4), 202105748, 2022. (IF: 13.3) [LinkBack Cover [pdf]


[J105] T. Nguyen, T. Dinh, V. Dau, A. R. Md Foisal, P. Guzman, H. Nguyen, T. A. Pham, T.-K. Nguyen, H.-P. Phan, N.-T. Nguyen, D. Dao, Piezoresistive Effect with a Gauge Factor of 18,000 in semiconductor heterojunction Modulated by Bonded Light Emitting Diodes, ACS Applied Materials & Interfaces, 13(29), 35046-35053, 2021. (IF: 9.23)

[J104] T. Nguyen, T. Dinh, H.-P. Phan, T.A. Pham, V.T. Dau, N.-T. Nguyen, D.V. Dao, Advances in ultrasensitive piezoresistive sensors: From conventional to flexible and stretchable applications, Materials Horizons, 8, 2123-2150, 2021. (IF: 14.4) [Link]

[J103] N.-K. Nguyen, P. Singha, H. An, H.-P. Phan, N.-T. Nguyen, C. H. Ooi, Electrostatically excited liquid marble as a micromixer, Reaction Chemistry & Engineering, 6, 1386-1394, 2021. (IF: 3.441) Front Cover

[J102] H.-Q. Nguyen, T. Nguyen, P. Tanner, T.-K. Nguyen, A.R. Md Foisal J. Fastier-Wooller, T.-H. Nguyen, H.-P. Phan, N.-T. Nguyen, D.V. Dao, Piezotronic effect in a normally-off p-GaN/AlGaN/GaN HEMT towards highly sensitive pressure sensor, Applied Physics Letters, 118, 242104. (IF: 3.597) [Link]

[J101] H. Fallahi, S. Yadav, H.-P. Phan, H. Ta, J. Zhang and N.-T. Nguyen, Size-tuneable isolation of cancer cells using stretchable inertial microfluidics, Lab on a Chip, 21, 2008-2018, 2021. (IF: 6.774) [Link]

[J100] N.-K. Nguyen, T. Nguyen, T.-K. Nguyen, S. Yadav, T. Dinh, M.K. Masud, P. Singha, T.N. Do, M.J. Barton, H. Ta, N. Kashaninejad, C.H. Ooi, N.-T. Nguyen, H.-P. Phan. Wide-band-gap semiconductors for biointegrated electronics: recent advances and future directions, ACS Applied  Electronics Materials, 3, 5, 1959-1981, 2021. (Cover page) [Link]

[J99] V. T. Dau,   T.T. Bui, C.-D. Tran, T.V. Nguyen, T.-K. Nguyen, T. Dinh, H.-P. Phan, D. Wibowo, B. Rehm, H.T. Ta, N.-T. Nguyen, D.V. Dao, In-Air Particle Generation by On-Chip Electrohydrodynamics, Lab on a Chip, 21, 1779-1787, 2021. (IF: 6.774) [Link]

[J98] V.T. Dau, H. Vu, C.-D. Tran, T. Nguyen, T.-K. Nguyen, T. Dinh, H.-P. Phan, K. Shimizu, N.-T. Nguyen, D.V. Dao, Electrospray propelled by ionic wind in a bipolar system for direct delivery of charge reduced nanoparticles, Applied Physics Express, 14, 055001,2021 (IF: 3.086) [Link]

[J97] H.-P. Phan. Implanted flexible electronics: Set device lifetime with smart nanomaterials, Micromachines, 12(2), 157, 2021. (IF: 2.523) [Link]

[J96] Z. Wan, S. Wang, B. Haylock, Z. Wu, T.-K. Nguyen, H.-P. Phan, R. Sang, N.-T. Nguyen, D. Thiel, S. Koulakov, Y. Gao, M. Lobino, Q. Li, Localized Surface Plasmon Enhanced Laser Reduction of Graphene Oxide for Wearable Strain Sensor, Advanced Materials Technologies, 6, 2001191, 2021. (IF: 5.969) [Link]

[J95] T. Nguyen, T. Dinh, V. T. Dau, C.-D. Tran, H.-P. Phan, T.-K. Nguyen, H. K. Nguyen, A.R. Md Foisal, P.G. Duran, N.-T. Nguyen, and D. V. Dao, A wearable, bending-insensitive respiration sensor using highly oriented carbon nanotube film, IEEE Sensors, 21(6), 7308, 2021. (IF: 3.076) [Link]

[J94] T. Nagaura,* H.-P. Phan,* V. Malgras, T.-A. Pham, H. Lim, A. Ashok, J. Kim, J. You, N.-T. Nguyen, J. Na, Y. Yamauchi, Universal Electrochemical Synthesis of Mesoporous Chalcogenide Semiconductors: Mesoporous CdSe and CdTe Thin Films for Optoelectronic Applications, Angewandte Chemie International Edition, 60(17), 9660, 2021. (IF: 12.959)

*Tomota and Phan equally contributed to this work. [Link]

[J93] T.A. Pham, L. Hold, A. lacopi, T.-K. Nguyen, H.H. Cheng, T. Dinh, D.V. Dao, H.T. Ta, N.-T. Nguyen, H.-P. Phan*, Wet oxidation of 3C-SiC on Si for MEMS processing and use in harsh environments: Effects of the film thicknesses, crystalline orientations, and growth temperatures, Sensors & Actuators A: Physics, 317, 112474, 2021. (IF: 2.904) [Link]

[J92] J. Nijhuis, Q.-D. Tran, N.N. Tran, T. Dinh, H.-P. Phan, N.-T. Nguyen, T.T. Tran, D. Losic, V. Hessel, Toward on-board Microchip Synthesis of CdSe vs PbSe Nanocrystalline Quantum Dots as a Spectral Decoy for Protecting Space Assets, Reaction Chemistry & Engineering, 6, 471-485, 2021. (IF: 3.441) [Link] [Back Cover]

[J91] N.-K. Nguyen, P. Singha, J. Zhang, H.-P. Phan, N.-T. Nguyen, C. H. Ooi, Digital imaging-based colourimetry for enzymatic processes in transparent liquid marbles, ChemPhysChem., 21, 1, 99-105, 2021. (IF: 3.144) [Link]


[J90] O. Cooper, H.-P. Phan, B. Wang, S. Lowe, C.J. Day, N.-T. Nguyen, J. Tiralongo, A functional microarray platform with self assembled monolayers on 3C-silicon carbide, Langmuir, 36, 44, 13181–13192, 2020. (IF: 3.557) [Link]

[J89] A.R. Md Foisal, A. Qamar, T. Nguyen, T. Dinh, H.-P. Phan, H. Nguyen, P.G. Duran, E.W. Streed, D.V. Dao, Ultra-sensitive self-powered position-sensitive detector based on horizontally-aligned double 3C-SiC/Si heterostructures, Nano Energy, 79, 105494, 2020. (IF: 16.602) [Link]

[J88] H. Park, M.K. Masud, J. Na, H. Lim, H.-P. Phan, Y.V. Kaneti, A.A. Alothman, C. Salomon, N.-T. Nguyen, Md. S.A. Hossain, Y. Yamauchi, Mesoporous Gold-Silver Alloy Films towards Amplification-Free Ultra-Sensitive microRNA Detection, Journal Material Chemistry B, 8, 9512-9523, 2020. (IF: 5.344) [Link]

[J87] C.-D. Tran, H.P. Pham, T. X. Dinh, T.-K. Nguyen, H.-P. Phan, T. Dinh, T. Nguyen, T.T. Bui, D.T. Chu, N.-T. Nguyen, D.V. Dao, V.T. Dau, A new structure of Tesla coupled nozzle in synthetic jet micro-pump, Sensors Actuators. A, 315, 112296, 2020. (IF: 2.904) [Link]

[J86] H. Fallahi, J. Zhang, J. Nicholls, H.-P. Phan, N.-T. Nguyen, A stretchable inertial microfluidic device for tunable particle separation, Analytical Chemistry, 92(18), 12473–12480, 2020. (IF: 6.785) [Link]

[J85] T.-A. Pham, A. Qamar, T. Dinh, M.K. Masud, M. Rais-Zadeh, D.G. Senesky, Y. Yamauchi, N.-T. Nguyen, H.-P. Phan*, Nanoarchitectonics for wide bandgap semiconductor nanowires: Toward the next generation of nanoelectromechanical systems for environmental monitoring, Advanced Science, 7(21), 2001294, 2020. (IF: 15.804) [Link]

[J84] T. Dinh, T. Nguyen, H.-P. Phan, N.-T. Nguyen, D.V. Dao, T. Ahfock, J. Bell, Stretchable respiration sensors: advanced designs and multimodal platforms for wearable physiological monitoring, Journal of Biosensors Bioelectronics, 17, 112460, 2020. (IF: 10.257) [Link]

[J83] P.G. Duran, T. Dinh, H.-P. Phan, A.P. Joy, A. Qamar, B. Bahreyni, Y. Zhu, M. Rais-Zadeh, N.-T. Nguyen, and D.V. Dao, Highly-doped SiC resonator with ultra-large tuning frequency range by Joule heating effect, Material & Design, 194, 108922, 2020. (IF: 6.289) [Link]

[J82] T.-A. Pham, T.-K. Nguyen, R.K. Vadivelu, T. Dinh, A. Qamar, S. Yadav, Y. Yamauchi, J.A. Rogers, N.-T. Nguyen, H.-P. Phan*, A Versatile Sacrificial Layer for Transfer Printing of Wide Bandgap Materials for Implantable and Stretchable Bioelectronics, Advanced Functional Materials, 30(43), 2004655, 2020. (IF: 16.836) [Link] Cover [Link]

[J81] N.-K. Nguyen, C.H. Ooi *, P. Singha, J. Jin, K.R. Sreejith, H.-P. Phan, N.-T. Nguyen, Liquid Marbles as Miniature Reactors for Chemical and Biological Applications, Processes, 8(7), 793, 2020. (IF: 2.973) [Link]

[J80] T. Nguyen, T. Dinh, H.-P. Phan, V.T. Dau, T.-K. Nguyen, A.P. Joy, B. Bahreyni, A. Qamar, M. Rais-Zadeh, D.G. Senesky, N.-T. Nguyen, D.V. Dao, Self-Powered Monolithic Accelerometer Using Photonic Gate, Nano Energy, 76, 104950, 2020. (IF: 16.602) [Link]

[J79] A. Qamar, H.-P. Phan, T. Dinh, N.-T. Nguyen, and M. Rais-Zadeh, A novel ScAlN/3C-SiC/Si platform for monolithic integration of highly sensitive piezoelectric and piezoresistive devices, Applied Physics Letters, 116, 132902, 2020. (IF: 3.521) [Link]

[J78] T. Dinh, T. Nguyen, A.R. Foisal, H.-P. Phan, T.-K. Nguyen, N.-T. Nguyen, and D. Dao, Optothermotronic effect as an ultrasensitive thermal sensing technology for solid-state electronics, Science Advances, 6(22), eaay2671, 2020. (IF: 12.804) [Link]

[J77] H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Qamar, T. Nguyen, V.T. Dau, J.S. Han, D.V. Dao, N.T. Nguyen, High temperature silicon-carbide-based flexible electronics for monitoring hazardous environments, Journal of Hazardous Materials, 394, 122486, 2020. (IF: 9.038) [Link]

[J76] T. Nguyen, T. Dinh, H.-P. Phan, A.R.Md Foisal, T.-K. Nguyen, N.-T. Nguyen, D.V. Dao, Opto-electronic coupling in semiconductors: towards ultrasensitive pressure sensing, Journal of  Material Chemistry C, 8, 4713, 2020. (IF:6.641) [Link] Back cover. 

[J75] T.-K. Nguyen*, H.-P. Phan*, K.M. Dowling, A. S. Yalamarthy, T. Dinh, V. Balakrishnan, T. Liu, C.A. Chapin, Q.-D. Truong, V.T. Dau, K.E. Goodson, D.G. Senesky, D.V. Dao, and N.-T. Nguyen, Lithography and etching-free microfabrication of silicon carbide on insulator using direct UV laser ablation, Advanced Engineering Materials, 22(4), 1901173, 2020. (IF: 2.319)  (* Equal contribution) [Link]

[J74] T. Dinh, T. Nguyen, H.-P. Phan, T.-K. Nguyen, V. Dau, N.-T. Nguyen, D. V. Dao, Advances in rational designs and materials of high-performance stretchable electromechanical sensors, Small, 16(14)1905707, 2020. (IF: 10.856) [Link]


[J73] H. Fallahi, J. Zhang, H.-P. Phan, and N.-T. Nguyen, Flexible microfluidics: fundamentals, recent developments and applications, Micromachines, 10, 830, 2019. (IF: 2.426) [Link] Front Cover [Link]


[J72] V. Balakrishnan, T. Dinh, A.R. Md Foisal, T. Nguyen, H.-P. Phan, D.V. Dao, and N.-T. Nguyen, Paper-based electronics using Graphite and Silver nanoparticles for respiration monitoring, IEEE Sensor Jounal, 19(24), 11784-11790, 2019. (IF: 3.076) [Link]


[J71] H.-P. Phan,* Y. Zhong, T.-K. Nguyen, Y. Park, T. Dinh, E. Song, R.K. Vadivelu, M. K. Masud, J. Li, M.J.A. Shiddiky, D.V. Dao, Y. Yamauchi, J. A. Rogers,* and N.-T. Nguyen,* Long-lived, transferred crystalline silicon carbide nanomembranes for implantable flexible electronics, ACS Nano, 13, 10, 11572-11581, 2019 (IF: 13.903) [Link] Cited by [Nature Materials] and [Cell


[J70] V.-T. Nguyen, T. Dinh, A.R. Md Foisal, H.-P. Phan, T.-K. Nguyen, N.-T. Nguyen, and V.D. Dao, Giant piezoresistive effect by optoelectronic coupling in a heterojunction,  Nature Communications, 10, 4139, 2019. (IF: 11.878) [Link]


[J69]   H.-P. Phan,* M.K. Masud,* R.K. Vadivelu, T. Dinh, T.-K. Nguyen, K. Ngo, D.V. Dao, M.J.A. Shiddiky, M.S.A. Hossain, Y. Yamauchi and N.-T. Nguyen, Transparent crystalline cubic SiC-on-glass electrodes enable simultaneous electrochemistry and optical microscopy,  Chemical Communications, 2019, 55, 7978 - 7981. (IF: 6.290) (* H.-P. Phan and M.K. Masud contributed equally to this work) [Link]


[J68]   T. Dinh, V. Dau, C.-D. Tran, T.-K. Nguyen, H.-P. Phan, N.-T. Nguyen and D. V. Dao, Polyacrylonitrile-carbon nanotube-polyacrylonitrile: a versatile robust platform for flexible multifunctional electronic devices in medical applications, Macromolecular Material Engineering, 190014, 2019. (IF: 2.690) [Link]

[J67]  A.R. Md. Foisal, T. Dinh, V.-T. Nguyen, P. tanner, H.-P. Phan, T.K. Nguyen, B. Haylock, E. Etreed, M. Lobino, and D. V. Dao, Self-powered broadband (UV-NIR) photodetector based on 3C-SiC/Si heterojunction, IEEE Transaction on Electron Device, 66(4), 1804-1809, 2019. (IF: 2.605) [Link]


[J66]  K. Boriachek, M. K. Masud, C. Palma, H.-P. Phan, Y. Yamauchi, M.S. Hossain, N.-T. Nguyen, and M.J.A. Shiddiky, Avoiding pre-isolation step in exosomes analysis:  Direct isolation and sensitive detection of exosomes using gold-loaded nanoporous ferric oxide nanozymes, Analytical Chemistry, 91, 6, 3827-3834, 2019. (IF: 6.320) [Link]


[J65]  H.-P. Phan, T. Dinh, , T.-K. Nguyen, T. Dinh, A. Qamar, A. Iacopi, J. Lu, D.V. Dao, M. Rais-Zadeh, and N.-T. Nguyen, Wireless battery-free SiC sensors operating in harsh environments using resonant inductive coupling, IEEE Electron Device Letter, 40(4), 609-612, 2019. [Link] (IF: 3.753)  

[J64] H. Q. Nguyen, H. A. Moghadam, T. Dinh, H.-P. Phan, T.-K. Nguyen, J. Han, N.-T. Nguyen, and D.V. Dao, Dependence of offset voltage in AlGaN/GaN van der Pauw devices under mechanical strain, Material Letter, 244(1), 66-69, 2019. [Link] (IF: 2.687)  


[J63] V. Balakrishnan, T. Dinh, T. Nguyen, H.-P. Phan, T.-K. Nguyen, D. V. Dao and N.-T. Nguyen, A hot-film air flow sensor for elevated temperatures, Review Scientific Instrument, 90, 015007, 2019. [Link] (IF: 1.428)  


[J62] T. Dinh, T.-K. Nguyen, H.-P. Phan, Q. Nguyen, J. Han, S. Dimitrijev, N.-T. Nguyen, D. V. Dao, Thermoresistance of p‐Type 4H–SiC Integrated MEMS Devices for High‐Temperature Sensing, Advanced Engineering Materials, 21(3), 1801049, 2019. [Link]   (IF: 2.319)  



[J61] J. Fastier-Wooller, T. Dinh, V. Dau, H.-P. Phan, F. Yang, D. V. Dao, Low-Cost Graphite on Paper Pressure Sensor for Robot Gripper with a Trivial Fabrication Process, Sensors, 18(10), 3300, 2018. [Link] (IF: 2.475)  


[J60] F. Lenzini, J. Janousek, O. Thearle, M. Villa, B. Haylock, S. Kasture, L. Cui, H.-P. Phan, D. V. Dao, H. Yonezawa, P. K. Lam, E. H. Huntington, M. Lobino,  "Integrated photonic platform for quantum information with continuous variables", Science Advances, 4(12), eaat9331, 2018. [Link]    (IF: 11.51)


[J59] H.-P. Phan, K.M. Dowling, T.-K. Nguyen,, C.A. Chapin, T. Dinh, R.A. Miller, J. Han, A. Iacopi, D.G. Senesky, D.V. Dao, and N.-T. Nguyen, Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures, RSC Advances, 8, 29976-29979, 2018. (IF: 2.936) [Link]


[J58]  T.-K. Nguyen, H.-P. Phan, T. Dinh, A.R. Md Foisal, N.-T. Nguyen, and D.V. Dao,  High-temperature tolerance of piezoresistive effect in p-4H-SiC for harsh environment sensing, Journal of Material Chemistry C, 6, 8613-8617, 2018. (IF: 5.976) [Link]


[J57]  T. Dinh*, H.-P. Phan*, N. Kashaninejad, T.-K. Nguyen, D.V. Dao, and N.-T. Nguyen, An on-chip SiC MEMS device with integrated heating, sensing and microfluidic cooling systems, Advanced Materials Interfaces, 5, 1800764, 2018. (IF: 4.834) (* H.-P. Phan and T. Dinh contributed equally to this work) [Link

[J56]  T.-K. Nguyen, H.-P. Phan, T. Dinh, K.M. Dowling, A.R. Md Foisal, D.G. Senesky, N.-T. Nguyen, and D.V. Dao, Highly sensitive 4H-SiC pressure sensor at cryogenic and elevated temperatures, Material & Design, 156, 441-445, 2018. (IF: 4.525) [Link]


[J55]  H.-P. Phan, T.-K. Nguyen, T. Dinh, H.H. Cheng, F. Mu, A. Iacopi, L. Hold, T. Suga, D.V. Dao, D.G. Senesky, and N.-T. Nguyen, Strain effect in highly doped n-type 3C-SiC-on-glass substrate for mechanical sensors and mobility enhancement, Physical Status Solidi A., 215(24), 1800288, 2018. (IF: 1.795) [Link] Front Cover [Link]


[J54]  A. Vatani, P. L. Woodfield, T. Dinh, H.-P. Phan, N.-T. Nguyen, D. V. Dao, Degraded boiling heat transfer from hotwire in ferrofluid due to particle deposition, Applied Thermal Engineering, 142, 255-261, 2018. (IF: 3.444) [Link]


[J53]  A.R. Md. Foisal, T. Dinh, P. tanner, H.-P. Phan, T.K. Nguyen, E. Etreed, D. V. Dao,  Photoresponse of a highly-rectifying 3C-SiC/Si heterostructure under UV and visible illumination, IEEE Electron Device Letter, 39, 1219-1222, 2018. (IF: 3.048) [Link]


[J52]  T.-K. Nguyen,  H.-P. Phan, T. Dinh, T. Toriyama, K. Nakamura, R.A. Md Foisal, N.-T. Nguyen, D.V. Dao, Isotropic piezoresistance of p-type 4H-SiC in (0001) plane, Applied Physics Letters, 113, 012104, 2018. (IF: 3.411) [Link]


[J51]   H.-P. Phan, Karen M. Dowling, T.-K. Nguyen, T. Dinh,  D.G. Senesky, T. Namazu, D.V. Dao, and N.-T. Nguyen, Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure, Material & Design, 15, 16-21, 2018. (IF: 4.525) [Link]


[J50]  V. Balakrishnan, T. Dinh, H.-P. Phan,  D.V. Dao, and N.-T. Nguyen, Highly Sensitive 3C-SiC on glass based thermal flow sensor realized using MEMS technology, Sensors & Actuators A: Physical, 279, 293-305, 2018. (IF: 2.499) [Link]


[J49] A.R. Md. Foisal*, H.-P. Phan*, T. Dinh, T.-K. Nguyen, N.-T. Nguyen, and D.V. Dao,  "A rapid and cost-effective metallization technique for 3C-SiC MEMS using direct wire bonding", RSC Advances, 8, 15310-15314, 2018. (IF: 3.048) (* H.-P. Phan and A.R. Md. Foisal contributed equally to this work) [Link]


[J48] Md. N. Islam, S. Moriam, M. Umer, H.-P. Phan,  C. Salomon, R. Kline, N.-T. Nguyen, and M.J.A. Shiddiky,  "Naked-eye and electrochemical detection of isothermally amplified HOTAIR long non-coding RNA", Analyst, 143, 3021-3028, 2018. (IF: 3.885) [Link] Inside Front Cover [Link]


[J47] T. Dinh, H.-P. Phan,  T.-K. Nguyen, V. Balakrishnan, H. Cheng, L. Hold, I. Iacopi, N.-T. Nguyen, and D.V. Dao,  "Unintentionally doped epitaxial 3C-SiC(111) nanothin film as material for highly sensitive thermal sensors at high temperatures", IEEE Electron Device Letter, 39(4), 580-583, 2018. (IF: 3.048) [Link]


[J46] T. Dinh, T.-K. Nguyen, H.-P. Phan,  F.-W. Jarred, C. D. Tran, N.-T. Nguyen, and D.V. Dao,  "Electrical resistance of carbon nanotube yarns under compressive transverse pressure", IEEE Electron Device Letter, 39(4), 584-587, 2018. (IF: 3.048) [Link]


[J45] T.-K. Nguyen, H.-P. Phan, J, Han, T. Dinh, A. R. M. Foisal, S. Dimitrijev, Y. Zhu, N.-T. Nguyen, and D.V. Dao,  "Highly sensitive p-type 4H-SiC Van der Pauw sensor", RSC Advances, 8, 3009-3013, 2018. (IF: 3.108) [Link]

[J44] H.-P. Phan, T.-K. Nguyen, T. Dinh, A. Iacopi, L. Hold, M. J. A. Shiddiky, D. V. Dao, and N.-T. Nguyen, "Robust free-standing nano-thin SiC membranes enable direct photolithography for MEMS sensing applications", Advanced Engineering Materials, 20, 1700858, 2018. [Link] (IF: 2.319) Back cover



[J43] P. Tanner, A. Iacopi,  H.-P. Phan, S. Dimitrijev, L. Hold, K. Chaik, G. Walker,D. V. Dao, and N.-T. Nguyen, "Excellent Rectifying Properties of the n-3C-SiC/p-Si Heterojunction Subjected to High Temperature Annealing for Electronics, MEMS, and LED Applications", Scientific Reports, 7, 17734, 2017. (IF: 4.259) [Link]

[J42] T.-K. Nguyen, H.-P. Phan, H. Kamble, R. Vadivelu, T. Dinh, A. Iacopi, G. Walker, L. Hold, N.-T. Nguyen, D.V. Dao, "Ultra-thin single crystalline SiC membrane as a versatile platform for biological applications", ACS Applied Materials & Interfaces, 9 (48), 41641- 41647, 2017. (IF: 7.504) [Link]


[J41] A.R. Md Foisal, A. Qamar, H.-P. Phan, T. Dinh, T-K Nguyen, P. Tanner, E. Streed, D.V. Dao, "Pushing the limits of piezoresistive effect by opto-mechanical coupling in 3C-SiC/Si heterostructure", ACS Applied Materials & Interfaces, 9 (46), 39921 - 39925, 2017. (IF: 7.504) [Link]

[J40] V. Balakrishnan, T. Dinh, H.-P. Phan,  D.V. Dao, and N.-T. Nguyen, "Generalised analytical model for Joule heating of segmented wires", ASME Journal of Heat Transfer, 17 (9), 2061, 2017. (IF: 1.866) [Link]


[J39] V. Balakrishnan, H.-P. Phan, T. Dinh,  D.V. Dao, and N.-T. Nguyen, "Thermal flow sensors for harsh environments," Sensor Journal, 17(9), 2061, 2017. (IF: 2.677) [Link]


[J38] H.-P. Phan, H.H. Cheng, T. Dinh,  B. Wood, T.-K. Nguyen, F. Mu, H. Kamble, R. Vadivelu, G. Walker, L. Hold, A. Iacopi, B. Haylock, D.V. Dao, M. Lobino, T. Suga, and N.-T. Nguyen, "Single crystalline 3C-SiC anodically bonded onto glass: an excellent platform for high temperature electronics and bio applications," ACS Applied Materials & Interfaces, 9 (33), pp. 27365–27371, 2017. (IF: 7.504) [Link]


[J37] T.-K. Nguyen, T. Dinh, H.-P. Phan, C.D. Tran, A. R. Md. Foisal, Y. Zhu, and D.V. Dao, "Electrically Stable Carbon Nanotube Yarn Under Tensile Strain," IEEE Electron Device Letter, vol. 38, no. 9, pp. 1331 - 1334, 2017. (IF: 3.032) [Link]

[J36] T. Dinh, H.-P. Phan, A. Qamar, P. Woodfield, N. T. Nguyen, and D.V. Dao,  "Thermoresistive effect for advanced thermal sensors: fundamentals, design considerations and applications," Journal of MicroElectroMechanical Systems, 26(5), 966-986, 2017 (IF: 2.124) [Link]

[J35] V. Balakrishnan, T. Dinh, H.-P. Phan, T. Kozeki, T. Namazu , D.V. Dao, N. T. Nguyen, "Steady-state analytical model of suspended p-type 3C-SiC bridges under consideration of Joule-heating," Journal  Micromechanics &  Microengineering, 27, 075008, 2017. (IF: 1.794) [Link]


[J34] T.-K. Nguyen, H.-P. Phan, T. Dinh, J. Han, S. Dimitrijev, P. Tanner, A. R. Md Foisal, Y. Zhu, N.-T. Nguyen, and D.V. Dao,"Experimental Investigation of Piezoresistive Effect in p-type 4H-SiC", IEEE Electron Device Letter, 38(7), 955-958, 4/2017 (IF 3.048) [Link]

[J33] T. Dinh, H.-P. Phan, T.-K. Nguyen, A. Qamar, P. Woodfield, Y. Zhu, N.-T. Nguyen, and D.V. Dao, "Solvent-Free Fabrication of Biodegradable Hot-Film Flow Sensor for Noninvasive Respiratory Monitoring", Journal of Physics D: Applied Physics, 50 (21), 215401, 2017 (IF 2.772) [Link]


[J32]  A. Qamar, D.V. Dao, J. Han, A. Iacopi, T. Dinh, H.-P. Phan, S. Dimitrijev, Piezo-Hall effect and fundamental piezo-Hall coefficients of single crystal n-type 3C-SiC(100) with low carrier concentration, Applied Physics Letters,

 110(16), 162903, 2017. (IF 3.411) [Link]

[J31] H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Vatani, A. R. Md Foisal, A. Qamar, A. R. Kermany, D. V. Dao, N.-T. Nguyen, Self-sensing paper-based actuators employing ferromagnetic nanoparticles and graphite, Applied Physics Letters, 110, 144101, 2017. [2016 IF: 3.411] [Link

[J30] H.-P. Phan, G. Ina, T. Dinh, T. Kozeki, T.-K. Nguyen, T. Namazu, A. Qamar, D. V. Dao, and N.-T. Nguyen, Formation of silicon carbide nanowire on insulator through direct wet oxidationMaterial Letter, 196, 280-283, 2017. [2016 IF: 2.572] [Link]

[J29] F. Lenzini, B. Haylock, J.C. Loredo, R.A. Abrahao, N.A. Zakaria, S. Kasture, I. Sagnes, A. Lemaitre, H.-P. Phan, D. V. Dao, P. Senellart, M.P. Almeida, A.G. White, M. Lobino, "Active demultiplexing of single-photons from a solid-state source," Laser Photonics Review, 11(3), 1770034, 2017.  [2016 IF: 8.434]   (Inside cover [Link] ) 


[J28] H.-P. Phan, T.-K. Nguyen, T. Dinh, G. Ina, A. R. Kermany, A. Qamar, J. Han, T. Namazu, R. Maeda, D. V. Dao, and N.-T. Nguyen, Ultra-high strain in epitaxial silicon carbide nanostructures utilizing residual stress amplification, Applied Physics Letters., 110, 141906, 2017. [2016 IF: 3.411] [pdf] [Link] (Selected as the Editor's pick in Vol. 110)

[J27]  T. Dinh, H.-P. Phan, T.-K. Nguyen, A. Qamar, A. R. M. Foisal, N. V. Thanh, C.-D. Tran, Y. Zhu, N.-T. Nguyen and D. V. Dao,  Environment-friendly carbon nanotube based flexible electronics for noninvasive and wearable healthcare, Journal of Material Chemistry C, 4, 10061-10068, 2016.  [2016 IF: 5.256] [pdf] [Link]


[J26]  H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen and D. V. Dao, Nano strain-amplifier: making ultra-sensitive piezoresistance in nanowires possible without the need of quantum and surface charge effects, Applied Physics Letters, 109, p. 123502, 2016. [2016 IF: 3.411] [pdf] [Link]  (Selected to the Editor's pick in Vol. 109, no. 13) 

[J25] A. R. M. Foisal, H.-P. Phan, T. Kozeki, T. Dinh, T.-K. Nguyen, A. Qamar, M. Lobino, T. Namazu, and D. V. Dao, "3C-SiC on glass: an ideal platform for temperature sensors under visible light illumination,'' RSC Advances, 6 (90), 87124-87127, 2016.  [2016 Impact Factor: 3.29] [pdf] [Link]

[J24] A. Qamar, D. V. Dao, H.-P. Phan, T. Dinh, and S. Dimitrijev, Fundamental piezo-Hall coefficients of single crystal p-type 3C-SiC for arbitrary crystallographic orientation, Applied Physics Letters, vol. 109, p. 092903, 2016.  [2016 Impact Factor: 3.142] [Link]

[J23] F.-W. Jarred, H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Cameron, A. Ochsner, and D. V. Dao, Novel low-cost sensor for human bite force measurement, Sensors Journal, vol. 16, no. 8, pp. 1244 (1-10), 2016.  [2015 Impact Factor: 2.033] [Link]

[J22] T. Dinh, H.-P. Phan, A. Qamar, N.-T. Nguyen, and D. V. Dao, Flexible and multifunctional electronics fabricated by a solvent-free and user-friendly method, RSC Advances, vol. 6, no. 81, pp. 77267-77274, 2016.  [2016 Impact Factor: 3.29] [Link]

[J21] H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen, and D. V. Dao, The piezoresistive effect in top-down fabricated p-type 3C-SiC nanowires, IEEE Electron Device Letters, vol. 37, no.8, pp. 1029-1302, 2016  [2015 Impact Factor: 2.75] [pdf] [Link]

[J20] H.-P. Phan, T. Dinh, T. Kozeki, A. Qamar, T. Namazu, S. Dimitrijev, N.-T. Nguyen, and D. V. Dao, Piezoresistive effect in p-type 3C-SiC at high temperatures characterized using Joule heating, Scientific Reports, vol. 6, pp. 28499 (1-10), 2016. [2015 Impact Factor: 5.58] [pdf] [Link

[J19] T. Kozeki, H.-P. Phan, D. V. Dao, S. Inoue, T. Namazu, Influence of gallium ion beam acceleration voltage on the bend angle of amorphous silicon cantilevers, Japanese Journal of Applied Physics, vol. 55, pp. 06GL02, 2016. [Link] [ 2015 Impact Factor: 1.13] [pdf]


[J18] T. Dinh, H.-P. Phan, T. Kozeki, A. Qamar, T. Fujii, T. Namazu, N.-T. Nguyen, and D. V. Dao, High thermoresistivity of silicon nanowires induced by amorphization, Material Letters, vol. 117, pp. 80-84, 2016. [Link] [ 2015 Impact Factor: 2.5] [pdf]


[J17] A. Qamar, H.-P. Phan, T. Dinh, L. Wang, S. Dimitrijev, and D. V. Dao, Piezo-Hall effect in 3C-SiC (100) thin film grown by low pressure chemical vapor deposition (LPCVD), RSC Advances, vol. 6, pp. 31191-31195, 2016.  [2015 Impact Factor: 3.84] 

[J16] D. V. Dao*, H.-P. Phan*,  A. Qamar, and T. Dinh,  Piezoresistive effect of single crystalline 3C-SiC on (111) plane, RSC Advances, vol. 6, pp. 21302-21307, 2016. (* H.-P. Phan and D. V. Dao contributed equally to this work) [2015 Impact Factor: 3.84]


[J15] T. Dinh*, H.-P. Phan*, T. Kozeki, A. Qamar, T. Namazu, N.-T. Nguyen, and D. V. Dao,  Thermoresistive properties of p-type 3C-SiC nanoscale thin films for high temperature MEMS thermal-based sensors, RSC Advances, 2015, 5(128), 106083-106086. (* H.-P. Phan and T. Dinh contributed equally to this work)  [2015 IF: 3.84] [pdf] [Link]


[J14] A. Qamar, D. V. Dao, J. Han, H.-P. Phan, A. Younis, P. Tanner, T. Dinh, L. Wang, and S. Dimitrijev, Pseudo-Hall effect in single crystal 3C-SiC(111) four-terminal devices, Journal of Material Chemistry C, 2015, 3 (48), 12394-12398.   [2015 IF: 4.7] [pdf] [Link]


[J13] H.-P. Phan, T. Kozeki, T. Dinh, A. Qamar, Y. Zhu, T. Namazu, N.-T. Nguyen, and D. V. Dao, Piezoresistive effect of p-type silicon nanowires fabricated by a top-down process using FIB implantation and wet etching, RSC Advances, vol. 5, pp. 82121-82126, 2015,  [2015 IF: 3.84] [pdf[Link]

[J12] H.-P. Phan, D. V. Dao, K. Nakamura, S. Dimitrijev, and N.-T. Nguyen, The Piezoresistive Effect of SiC for MEMS Sensors at High Temperatures: A Review, Journal of MicroElectroMechanical Systems, vol. 24, no. 6, pp. 1663-1677, 2015.   [2015 IF: 1.754] [pdf[Link]

[J11] A. Qamar, H.-P. Phan, J. Han, P. Tanner, T. Dinh, L. Wang, S. Dimitrijev, and D. V. Dao, Effect of device geometries and crystal orientations on the stress-dependent offset voltage of 3C-SiC(100) four terminal devices, Journal of Material Chemistry C, 3(34), 2015, pp. 8804 - 8809. [pdf[Link]      [2015 IF: 4.7]

[J10] T. Dinh, H.-P. Phan, D. V. Dao, P. Woodfield, A. Qamar, and N.-T. Nguyen, "Graphite on Paper as Material for Sensitive Thermoresistive Sensors," Journal of Material Chemistry C, 2015, 3(34), 8776 - 8779.  [Link]     [2015 IF: 4.7]  Back cover of J.  Mater. Chem. C [pdf] [link] (Designer: Hoang-Phuong Phan)


[J9] H.-P. Phan *,  A. Qamar *, D. V. Dao, T. Dinh, L. Wang, J. Han, P. Tanner, S. Dimitrijev, and N.-T. Nguyen, ''Orientation dependence of the pseudo-Hall effect in p-type 3C-SiC four-terminal devices under mechanical stress,'' RSC Advances, 5, 56377-56381, 2015. [pdf] (* H.-P. Phan and A. Qamar contributed equally to this work). [Link]    [2015 IF: 3.84]

[J8] T. Dinh, D. V. Dao, H.-P. Phan, L. Wang, A. Qamar, N.-T. Nguyen, P. Tanner, M. Rybachuk, Charge transport and activation energy of amorphous silicon carbide thin film on quartz at elevated temperature, Applied Physics Express, 8, 061303-1, 2015. [pdf[Link]     [2015 Impact Factor: 2.4]      Featured in Appl. Phys. Exp. Spotlights 2015       

[J7] A. Qamar *, H.-P. Phan *, D. V. Dao, P. Tanner, T. Dinh, L. Wang, and S. Dimitrijev, The dependence of offset voltage in p-type 3C-SiC Van Der Pauw  device on applied strain, IEEE Electron Device Letter, 36(7), 708-710, 2015. (* A. Qamar and H.-P. Phan contributed equally to this work). [pdf] [Link]            [2015 IF: 2.8]

[J6] A. Qamar, D. V. Dao, P. Tanner, H.-P. Phan, T. Dinh, and S. Dimitrijev, Influence of External Mechanical Stress on the Electrical Properties of Single Crystal n-3C-SiC/p-Si Heterojunction Diode, Applied Physics Express, 8, 061302-1, 2015. [pdf[Link]           [2015 IF: 2.4]

[J5] H.-P. Phan, D. V. Dao, L. Wang, T. Dinh, N.-T. Nguyen, A. Qamar, P. Tanner, S. Dimitrijev, and Y. Zhu, Strain effect on electrical conductance of p-type nanocrystalline SiC thin film, Journal of Material Chemistry C, vol. 3, pp. 1172-1176, 2015. [pdf[Link]           [2015 IF: 4.7]



[J4] A. Qamar, P. Tanner, D. V. Dao, H.-P. Phan, and T. Dinh, Electrical Properties of p-type 3C-SiC/Si Heterojunction Diode Under Mechanical Stress, IEEE Electron Device Letter, 35(12), 1293 - 1295, 2014. [pdf[Link] [2014 IF: 3.0]

[J3] H.-P. Phan, D. V. Dao, P. Tanner, J. Han, N.-T. Nguyen, S. Dimitrijev, G. Walker, L. Wang, and Y. Zhu, Thickness dependence of the piezoresistive effect in p-type single crystalline 3C-SiC nanothin films, Journal of
 Material Chemistry C, vol. 2, no. 35, pp. 7176-7179, 2014. [pdf[Link]    [2014 IF: 6.6]

[J2] H.-P. Phan, D. V. Dao, P. Tanner, L. Wang, N.-T. Nguyen, Y. Zhu, S. Dimitrijev, Fundamental piezoresistive coefficients of p-type single crystalline 3C-SiC, Applied Physics Letters, 104(11), 111905, 2014. [pdf[Link] [2014 IF: 3.5]

[J1] H.-P. Phan, P. Tanner, D. V. Dao, L. Wang, N.-T. Nguyen, Y. Zhu, S. Dimitrijev, Piezoresistive Effect of p-Type Single Crystalline 3C-SiC Thin Film, IEEE Electron Device Letter, 35(3), 399-401, 2014. [pdf[Link] [2014 IF: 3.0]

Cover pages

Cover 20.jpg
Cover 8.PNG
Cover 10.JPG
Cover 9.JPG
Mater Horizon.JPG
Cover 7.PNG
UNSW logo.png
bottom of page