Journal papers


[J90] O. Cooper, H.-P. Phan, B. Wang, S. Lowe, C.J. Day, N.-T. Nguyen, J. Tiralongo, A functional microarray platform with self assembled monolayers on 3C-silicon carbide, Langmuir, 2020. Accepted (IF: 3.557)

[J89] A.R. Md Foisal, A. Qamar, T. Nguyen, T. Dinh, H.-P. Phan, H. Nguyen, P.G. Duran, E.W. Streed, D.V. Dao, Ultra-sensitive self-powered position-sensitive detector based on horizontally-aligned double 3C-SiC/Si heterostructures, Nano Energy, 2020. Accepted (IF: 16.602) [Link]

[J88] H. Park, M.K. Masud, J. Na, H. Lim, H.-P. Phan, Y.V. Kaneti, A.A. Alothman, C. Salomon, N.-T. Nguyen, Md. S.A. Hossain, Y. Yamauchi, Mesoporous Gold-Silver Alloy Films towards Amplification-Free Ultra-Sensitive microRNA Detection, J. Mater Chem. B, 2020. Accepted (IF: 5.344) [Link]

[J87] C.-D. Tran, H.P. Pham, T. X. Dinh, T.-K. Nguyen, H.-P. Phan, T. Dinh, T. Nguyen, T.T. Bui, D.T. Chu, N.-T. Nguyen, D.V. Dao, V.T. Dau, A new structure of Tesla coupled nozzle in synthetic jet micro-pump, Sensors Actuators. A, 315, 112296, 2020. (IF: 2.904) [Link]

[J86] H. Fallahi, J. Zhang, J. Nicholls, H.-P. Phan, N.-T. Nguyen, A stretchable inertial microfluidic device for tunable particle separation, Anal. Chem., 92(18), 12473–12480, 2020. (IF: 6.785) [Link]

[J85] T.-A. Pham, A. Qamar, T. Dinh, M.K. Masud, M. Rais-Zadeh, D.G. Senesky, Y. Yamauchi, N.-T. Nguyen, H.-P. Phan*, Nanoarchitectonics for wide bandgap semiconductor nanowires: Toward the next generation of nanoelectromechanical systems for environmental monitoring, Adv. Sci., 2001294, 2020. (IF: 15.804) [Link]

[J84] T. Dinh, T. Nguyen, H.-P. Phan, N.-T. Nguyen, D.V. Dao, T. Ahfock, J. Bell, Stretchable respiration sensors: advanced designs and multimodal platforms for wearable physiological monitoring, J. Biosen. Bioelectron., 17, 112460, 2020. (IF: 10.257) [Link]

[J83] P.G. Duran, T. Dinh, H.-P. Phan, A.P. Joy, A. Qamar, B. Bahreyni, Y. Zhu, M. Rais-Zadeh, N.-T. Nguyen, and D.V. Dao, Highly-doped SiC resonator with ultra-large tuning frequency range by Joule heating effect, Mater. Des., 194, 108922, 2020. (IF: 6.289) [Link]

[J82] T.-A. Pham, T.-K. Nguyen, R.K. Vadivelu, T. Dinh, A. Qamar, S. Yadav, Y. Yamauchi, J.A. Rogers, N.-T. Nguyen, H.-P. Phan*, A Versatile Sacrificial Layer for Transfer Printing of Wide Bandgap Materials for Implantable and Stretchable Bioelectronics, Adv. Funct. Mater., 30(43), 2004655, 2020. (IF: 16.836) [Link] Cover [Link]

[J81] N.-K. Nguyen, C.H. Ooi *, P. Singha, J. Jin, K.R. Sreejith, H.-P. Phan, N.-T. Nguyen, Liquid Marbles as Miniature Reactors for Chemical and Biological Applications, Processes, 8(7), 793, 2020. (IF: 2.973) [Link]

[J80] T. Nguyen, T. Dinh, H.-P. Phan, V.T. Dau, T.-K. Nguyen, A.P. Joy, B. Bahreyni, A. Qamar, M. Rais-Zadeh, D.G. Senesky, N.-T. Nguyen, D.V. Dao, Self-Powered Monolithic Accelerometer Using Photonic Gate, Nano Energy, 76, 104950, 2020. (IF: 16.602) [Link]

[J79] A. Qamar, H.-P. Phan, T. Dinh, N.-T. Nguyen, and M. Rais-Zadeh, A novel ScAlN/3C-SiC/Si platform for monolithic integration of highly sensitive piezoelectric and piezoresistive devices, Appl. Phys. Lett., 116, 132902, 2020. (IF: 3.521) [Link]

[J78] T. Dinh, T. Nguyen, A.R. Foisal, H.-P. Phan, T.-K. Nguyen, N.-T. Nguyen, and D. Dao, Optothermotronic effect as an ultrasensitive thermal sensing technology for solid-state electronics, Science Advances, 6(22), eaay2671, 2020. (IF: 12.804) [Link]

[J77] H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Qamar, T. Nguyen, V.T. Dau, J.S. Han, D.V. Dao, N.T. Nguyen, High temperature silicon-carbide-based flexible electronics for monitoring hazardous environments, J. Hazard. Mater., 394, 122486, 2020. (IF: 9.038) [Link]

[J76] T. Nguyen, T. Dinh, H.-P. Phan, A.R.Md Foisal, T.-K. Nguyen, N.-T. Nguyen, D.V. Dao, Opto-electronic coupling in semiconductors: towards ultrasensitive pressure sensing, J. Mater. Chem. C, 8, 4713, 2020. (IF:6.641) [Link] Back cover. 

[J75] T.-K. Nguyen*, H.-P. Phan*, K.M. Dowling, A. S. Yalamarthy, T. Dinh, V. Balakrishnan, T. Liu, C.A. Chapin, Q.-D. Truong, V.T. Dau, K.E. Goodson, D.G. Senesky, D.V. Dao, and N.-T. Nguyen, Lithography and etching-free microfabrication of silicon carbide on insulator using direct UV laser ablation, Adv. Eng. Mater., 1901173, 2020. (IF: 2.319)  (* Equal contribution) [Link]


[J74] T. Dinh, T. Nguyen, H.-P. Phan, T.-K. Nguyen, V. Dau, N.-T. Nguyen, D. V. Dao, Advances in rational designs and materials of high-performance stretchable electromechanical sensors, Small, 1905707, 2020. (IF: 10.856) [Link]


[J73] H. Fallahi, J. Zhang, H.-P. Phan, and N.-T. Nguyen, Flexible microfluidics: fundamentals, recent developments and applications, Micromachines, 10, 830, 2019. (IF: 2.426) [Link] Front Cover [Link]


[J72] V. Balakrishnan, T. Dinh, A.R. Md Foisal, T. Nguyen, H.-P. Phan, D.V. Dao, and N.-T. Nguyen, Paper-based electronics using Graphite and Silver nanoparticles for respiration monitoring, IEEE Sensor J., 19(24), 11784-11790, 2019. (IF: 3.076) [Link]


[J71] H.-P. Phan,* Y. Zhong, T.-K. Nguyen, Y. Park, T. Dinh, E. Song, R.K. Vadivelu, M. K. Masud, J. Li, M.J.A. Shiddiky, D.V. Dao, Y. Yamauchi, J. A. Rogers,* and N.-T. Nguyen,* Long-lived, transferred crystalline silicon carbide nanomembranes for implantable flexible electronics, ACS Nano, 13, 10, 11572-11581, 2019 (IF: 13.903) [Link] Cited by [Nature Materials] and [Cell


[J70] V.-T. Nguyen, T. Dinh, A.R. Md Foisal, H.-P. Phan, T.-K. Nguyen, N.-T. Nguyen, and V.D. Dao, Giant piezoresistive effect by optoelectronic coupling in a heterojunction,  Nature Comm., 10, 4139, 2019. (IF: 11.878) [Link]


[J69]   H.-P. Phan,* M.K. Masud,* R.K. Vadivelu, T. Dinh, T.-K. Nguyen, K. Ngo, D.V. Dao, M.J.A. Shiddiky, M.S.A. Hossain, Y. Yamauchi and N.-T. Nguyen, Transparent crystalline cubic SiC-on-glass electrodes enable simultaneous electrochemistry and optical microscopy,  Chem. Comm., 2019, 55, 7978 - 7981. (IF: 6.290) (* H.-P. Phan and M.K. Masud contributed equally to this work) [Link]


[J68]   T. Dinh, V. Dau, C.-D. Tran, T.-K. Nguyen, H.-P. Phan, N.-T. Nguyen and D. V. Dao, Polyacrylonitrile-carbon nanotube-polyacrylonitrile: a versatile robust platform for flexible multifunctional electronic devices in medical applications, Macromolecular Mater. Eng., 190014, 2019. (IF: 2.690) [Link]

[J67]  A.R. Md. Foisal, T. Dinh, V.-T. Nguyen, P. tanner, H.-P. Phan, T.K. Nguyen, B. Haylock, E. Etreed, M. Lobino, and D. V. Dao, Self-powered broadband (UV-NIR) photodetector based on 3C-SiC/Si heterojunction, IEEE Trans. Electron Device, 66(4), 1804-1809, 2019. (IF: 2.605) [Link]


[J66]  K. Boriachek, M. K. Masud, C. Palma, H.-P. Phan, Y. Yamauchi, M.S. Hossain, N.-T. Nguyen, and M.J.A. Shiddiky, Avoiding pre-isolation step in exosomes analysis:  Direct isolation and sensitive detection of exosomes using gold-loaded nanoporous ferric oxide nanozymes, Anal. Chem., 91, 6, 3827-3834, 2019. (IF: 6.320) [Link]


[J65]  H.-P. Phan, T. Dinh, , T.-K. Nguyen, T. Dinh, A. Qamar, A. Iacopi, J. Lu, D.V. Dao, M. Rais-Zadeh, and N.-T. Nguyen, Wireless battery-free SiC sensors operating in harsh environments using resonant inductive coupling, IEEE Electron Device Lett., 40(4), 609-612, 2019. [Link] (IF: 3.753)  


[J64] H. Q. Nguyen, H. A. Moghadam, T. Dinh, H.-P. Phan, T.-K. Nguyen, J. Han, N.-T. Nguyen, and D.V. Dao, Dependence of offset voltage in AlGaN/GaN van der Pauw devices under mechanical strain, Mater. Lett., 244(1), 66-69, 2019. [Link] (IF: 2.687)  


[J63] V. Balakrishnan, T. Dinh, T. Nguyen, H.-P. Phan, T.-K. Nguyen, D. V. Dao and N.-T. Nguyen, A hot-film air flow sensor for elevated temperatures, Rev. Sci. Instrum., 90, 015007, 2019. [Link] (IF: 1.428)  


[J62] T. Dinh, T.-K. Nguyen, H.-P. Phan, Q. Nguyen, J. Han, S. Dimitrijev, N.-T. Nguyen, D. V. Dao, Thermoresistance of p‐Type 4H–SiC Integrated MEMS Devices for High‐Temperature Sensing, Adv. Eng. Mater., 21(3), 1801049, 2019. [Link]   (IF: 2.319)  



[J61] J. Fastier-Wooller, T. Dinh, V. Dau, H.-P. Phan, F. Yang, D. V. Dao, Low-Cost Graphite on Paper Pressure Sensor for Robot Gripper with a Trivial Fabrication Process, Sensors, 18(10), 3300, 2018. [Link] (IF: 2.475)  


[J60] F. Lenzini, J. Janousek, O. Thearle, M. Villa, B. Haylock, S. Kasture, L. Cui, H.-P. Phan, D. V. Dao, H. Yonezawa, P. K. Lam, E. H. Huntington, M. Lobino,  "Integrated photonic platform for quantum information with continuous variables", Science Advances, 4(12), eaat9331, 2018. [Link]    (IF: 11.51)


[J59] H.-P. Phan, K.M. Dowling, T.-K. Nguyen,, C.A. Chapin, T. Dinh, R.A. Miller, J. Han, A. Iacopi, D.G. Senesky, D.V. Dao, and N.-T. Nguyen, Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures, RSC Adv., 8, 29976-29979, 2018. (IF: 2.936) [Link]


[J58]  T.-K. Nguyen, H.-P. Phan, T. Dinh, A.R. Md Foisal, N.-T. Nguyen, and D.V. Dao,  High-temperature tolerance of piezoresistive effect in p-4H-SiC for harsh environment sensing, J. Mater. Chem. C, 6, 8613-8617, 2018. (IF: 5.976) [Link]


[J57]  T. Dinh*, H.-P. Phan*, N. Kashaninejad, T.-K. Nguyen, D.V. Dao, and N.-T. Nguyen, An on-chip SiC MEMS device with integrated heating, sensing and microfluidic cooling systems, Adv. Mater. Interfaces, 5, 1800764, 2018. (IF: 4.834) (* H.-P. Phan and T. Dinh contributed equally to this work) [Link


[J56]  T.-K. Nguyen, H.-P. Phan, T. Dinh, K.M. Dowling, A.R. Md Foisal, D.G. Senesky, N.-T. Nguyen, and D.V. Dao, Highly sensitive 4H-SiC pressure sensor at cryogenic and elevated temperatures, Mater. Des., 156, 441-445, 2018. (IF: 4.525) [Link]


[J55]  H.-P. Phan, T.-K. Nguyen, T. Dinh, H.H. Cheng, F. Mu, A. Iacopi, L. Hold, T. Suga, D.V. Dao, D.G. Senesky, and N.-T. Nguyen, Strain effect in highly doped n-type 3C-SiC-on-glass substrate for mechanical sensors and mobility enhancement, Phys. Sta. Sol. A., Accepted 7/2018. (IF: 1.795) [Link] Front Cover [Link]


[J54]  A. Vatani, P. L. Woodfield, T. Dinh, H.-P. Phan, N.-T. Nguyen, D. V. Dao, Degraded boiling heat transfer from hotwire in ferrofluid due to particle deposition, Appl. Therm. Eng., 142, 255-261, 2018. (IF: 3.444) [Link]


[J53]  A.R. Md. Foisal, T. Dinh, P. tanner, H.-P. Phan, T.K. Nguyen, E. Etreed, D. V. Dao,  Photoresponse of a highly-rectifying 3C-SiC/Si heterostructure under UV and visible illumination, IEEE Electron Device Lett., 39, 1219-1222, 2018. (IF: 3.048) [Link]


[J52]  T.-K. Nguyen,  H.-P. Phan, T. Dinh, T. Toriyama, K. Nakamura, R.A. Md Foisal, N.-T. Nguyen, D.V. Dao, Isotropic piezoresistance of p-type 4H-SiC in (0001) plane, Appl. Phys. Lett., 113, 012104, 2018. (IF: 3.411) [Link]


[J51]   H.-P. Phan, Karen M. Dowling, T.-K. Nguyen, T. Dinh,  D.G. Senesky, T. Namazu, D.V. Dao, and N.-T. Nguyen, Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure, Mater. Des., 15, 16-21, 2018. (IF: 4.525) [Link]


[J50]  V. Balakrishnan, T. Dinh, H.-P. Phan,  D.V. Dao, and N.-T. Nguyen, Highly Sensitive 3C-SiC on glass based thermal flow sensor realized using MEMS technology, Sensors & Actuators A: Physical, 279, 293-305, 2018. (IF: 2.499) [Link]


[J49] A.R. Md. Foisal*, H.-P. Phan*, T. Dinh, T.-K. Nguyen, N.-T. Nguyen, and D.V. Dao,  "A rapid and cost-effective metallization technique for 3C-SiC MEMS using direct wire bonding", RSC Advances, 8, 15310-15314, 2018. (IF: 3.048) (* H.-P. Phan and A.R. Md. Foisal contributed equally to this work) [Link]


[J48] Md. N. Islam, S. Moriam, M. Umer, H.-P. Phan,  C. Salomon, R. Kline, N.-T. Nguyen, and M.J.A. Shiddiky,  "Naked-eye and electrochemical detection of isothermally amplified HOTAIR long non-coding RNA", Analyst, 143, 3021-3028, 2018. (IF: 3.885) [Link] Inside Front Cover [Link]


[J47] T. Dinh, H.-P. Phan,  T.-K. Nguyen, V. Balakrishnan, H. Cheng, L. Hold, I. Iacopi, N.-T. Nguyen, and D.V. Dao,  "Unintentionally doped epitaxial 3C-SiC(111) nanothin film as material for highly sensitive thermal sensors at high temperatures", IEEE Electron Device Lett., 39(4), 580-583, 2018. (IF: 3.048) [Link]


[J46] T. Dinh, T.-K. Nguyen, H.-P. Phan,  F.-W. Jarred, C. D. Tran, N.-T. Nguyen, and D.V. Dao,  "Electrical resistance of carbon nanotube yarns under compressive transverse pressure", IEEE Electron Device Lett., Accepted, 2018. (IF: 3.048) [Link]


[J45] T.-K. Nguyen, H.-P. Phan, J, Han, T. Dinh, A. R. M. Foisal, S. Dimitrijev, Y. Zhu, N.-T. Nguyen, and D.V. Dao,  "Highly sensitive p-type 4H-SiC Van der Pauw sensor", RSC Advances, 8, 3009-3013, 2018. (IF: 3.108) [Link]

[J44] H.-P. Phan, T.-K. Nguyen, T. Dinh, A. Iacopi, L. Hold, M. J. A. Shiddiky, D. V. Dao, and N.-T. Nguyen, "Robust free-standing nano-thin SiC membranes enable direct photolithography for MEMS sensing applications", Adv. Eng. Mater., 20, 1700858, 2018. [Link] (IF: 2.319) Back cover



[J43] P. Tanner, A. Iacopi,  H.-P. Phan, S. Dimitrijev, L. Hold, K. Chaik, G. Walker,D. V. Dao, and N.-T. Nguyen, "Excellent Rectifying Properties of the n-3C-SiC/p-Si Heterojunction Subjected to High Temperature Annealing for Electronics, MEMS, and LED Applications", Sci. Rep., 7, 17734, 2017. (IF: 4.259) [Link]

[J42] T.-K. Nguyen, H.-P. Phan, H. Kamble, R. Vadivelu, T. Dinh, A. Iacopi, G. Walker, L. Hold, N.-T. Nguyen, D.V. Dao, "Ultra-thin single crystalline SiC membrane as a versatile platform for biological applications", ACS Appl. Mater. Interfaces, 9 (48), 41641- 41647, 2017. (IF: 7.504) [Link]


[J41] A.R. Md Foisal, A. Qamar, H.-P. Phan, T. Dinh, T-K Nguyen, P. Tanner, E. Streed, D.V. Dao, "Pushing the limits of piezoresistive effect by opto-mechanical coupling in 3C-SiC/Si heterostructure", ACS Appl. Mater. Interfaces, 9 (46), 39921 - 39925, 2017. (IF: 7.504) [Link]


[J40] V. Balakrishnan, T. Dinh, H.-P. Phan,  D.V. Dao, and N.-T. Nguyen, "Generalised analytical model for Joule heating of segmented wires", ASME J. Heat Transfer, 17 (9), 2061, 2017. (IF: 1.866) [Link]


[J39] V. Balakrishnan, H.-P. Phan, T. Dinh,  D.V. Dao, and N.-T. Nguyen, "Thermal flow sensors for harsh environments," Sensor J., 2017, accepted. (IF: 2.677) [Link]


[J38] H.-P. Phan, H.H. Cheng, T. Dinh,  B. Wood, T.-K. Nguyen, F. Mu, H. Kamble, R. Vadivelu, G. Walker, L. Hold, A. Iacopi, B. Haylock, D.V. Dao, M. Lobino, T. Suga, and N.-T. Nguyen, "Single crystalline 3C-SiC anodically bonded onto glass: an excellent platform for high temperature electronics and bio applications," ACS Appl. Mater. Interfaces, 9 (33), pp. 27365–27371, 2017. (IF: 7.504) [Link]


[J37] T.-K. Nguyen, T. Dinh, H.-P. Phan, C.D. Tran, A. R. Md. Foisal, Y. Zhu, and D.V. Dao, "Electrically Stable Carbon Nanotube Yarn Under Tensile Strain," IEEE Electron Device Lett., vol. 38, no. 9, pp. 1331 - 1334, 2017. (IF: 3.032) [Link]

[J36] T. Dinh, H.-P. Phan, A. Qamar, P. Woodfield, N. T. Nguyen, and D.V. Dao,  "Thermoresistive effect for advanced thermal sensors: fundamentals, design considerations and applications," JMEMS, 26(5), 966-986, 2017 (IF: 2.124) [Link]

[J35] V. Balakrishnan, T. Dinh, H.-P. Phan, T. Kozeki, T. Namazu , D.V. Dao, N. T. Nguyen, "Steady-state analytical model of suspended p-type 3C-SiC bridges under consideration of Joule-heating," J.  Micromech.  Microeng., 27, 075008, 2017. (IF: 1.794) [Link]


[J34] T.-K. Nguyen, H.-P. Phan, T. Dinh, J. Han, S. Dimitrijev, P. Tanner, A. R. Md Foisal, Y. Zhu, N.-T. Nguyen, and D.V. Dao,"Experimental Investigation of Piezoresistive Effect in p-type 4H-SiC", IEEE Electron Device Lett., 38(7), 955-958, 4/2017 (IF 3.048) [Link]


[J33] T. Dinh, H.-P. Phan, T.-K. Nguyen, A. Qamar, P. Woodfield, Y. Zhu, N.-T. Nguyen, and D.V. Dao, "Solvent-Free Fabrication of Biodegradable Hot-Film Flow Sensor for Noninvasive Respiratory Monitoring", J. Phys. D: Appl. Phys., 50 (21), 215401, 2017 (IF 2.772) [Link]


[J32]  A. Qamar, D.V. Dao, J. Han, A. Iacopi, T. Dinh, H.-P. Phan, S. Dimitrijev, Piezo-Hall effect and fundamental piezo-Hall coefficients of single crystal n-type 3C-SiC(100) with low carrier concentration, Appl. Phys. Lett.,

 110(16), 162903, 2017. (IF 3.411) [Link]

[J31] H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Vatani, A. R. Md Foisal, A. Qamar, A. R. Kermany, D. V. Dao, N.-T. Nguyen, Self-sensing paper-based actuators employing ferromagnetic nanoparticles and graphite, Appl. Phys. Lett., 110, 144101, 2017. [2016 IF: 3.411] [Link

[J30] H.-P. Phan, G. Ina, T. Dinh, T. Kozeki, T.-K. Nguyen, T. Namazu, A. Qamar, D. V. Dao, and N.-T. Nguyen, Formation of silicon carbide nanowire on insulator through direct wet oxidationMater. Lett., 196, 280-283, 2017. [2016 IF: 2.572] [Link]

[J29] F. Lenzini, B. Haylock, J.C. Loredo, R.A. Abrahao, N.A. Zakaria, S. Kasture, I. Sagnes, A. Lemaitre, H.-P. Phan, D. V. Dao, P. Senellart, M.P. Almeida, A.G. White, M. Lobino, "Active demultiplexing of single-photons from a solid-state source," Laser Photonics Rev., 11(3), 1770034, 2017.  [2016 IF: 8.434]   (Inside cover [Link] ) 


[J28] H.-P. Phan, T.-K. Nguyen, T. Dinh, G. Ina, A. R. Kermany, A. Qamar, J. Han, T. Namazu, R. Maeda, D. V. Dao, and N.-T. Nguyen, Ultra-high strain in epitaxial silicon carbide nanostructures utilizing residual stress amplification, Appl. Phys. Letts., 110, 141906, 2017. [2016 IF: 3.411] [Link] (Selected as the Editor's pick in Vol. 110)

[J27]  T. Dinh, H.-P. Phan, T.-K. Nguyen, A. Qamar, A. R. M. Foisal, N. V. Thanh, C.-D. Tran, Y. Zhu, N.-T. Nguyen and D. V. Dao,  Environment-friendly carbon nanotube based flexible electronics for noninvasive and wearable healthcare, J. Mater. Chem. C, 4, 10061-10068, 2016.  [2016 IF: 5.256] [Link]


[J26]  H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen and D. V. Dao, Nano strain-amplifier: making ultra-sensitive piezoresistance in nanowires possible without the need of quantum and surface charge effects, Appl. Phys. Lett., 109, p. 123502, 2016. [2016 IF: 3.411] [Link]  (Selected to the Editor's pick in Vol. 109, no. 13) 

[J25] A. R. M. Foisal, H.-P. Phan, T. Kozeki, T. Dinh, T.-K. Nguyen, A. Qamar, M. Lobino, T. Namazu, and D. V. Dao, "3C-SiC on glass: an ideal platform for temperature sensors under visible light illumination,'' RSC Adv., 6 (90), 87124-87127, 2016.  [2016 Impact Factor: 3.29] [Link]

[J24] A. Qamar, D. V. Dao, H.-P. Phan, T. Dinh, and S. Dimitrijev, Fundamental piezo-Hall coefficients of single crystal p-type 3C-SiC for arbitrary crystallographic orientation, Appl. Phys. Lett., vol. 109, p. 092903, 2016.  [2016 Impact Factor: 3.142] [Link]

[J23] F.-W. Jarred, H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Cameron, A. Ochsner, and D. V. Dao, Novel low-cost sensor for human bite force measurement, Sensors J., vol. 16, no. 8, pp. 1244 (1-10), 2016.  [2015 Impact Factor: 2.033] [Link]

[J22] T. Dinh, H.-P. Phan, A. Qamar, N.-T. Nguyen, and D. V. Dao, Flexible and multifunctional electronics fabricated by a solvent-free and user-friendly method, RSC Adv., vol. 6, no. 81, pp. 77267-77274, 2016.  [2016 Impact Factor: 3.29] [Link]

[J21] H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen, and D. V. Dao, The piezoresistive effect in top-down fabricated p-type 3C-SiC nanowires, IEEE Electron Device Lett., vol. 37, no.8, pp. 1029-1302, 2016  [2015 Impact Factor: 2.75] [Link]

[J20] H.-P. Phan, T. Dinh, T. Kozeki, A. Qamar, T. Namazu, S. Dimitrijev, N.-T. Nguyen, and D. V. Dao, Piezoresistive effect in p-type 3C-SiC at high temperatures characterized using Joule heating, Scie. Rep., vol. 6, pp. 28499 (1-10), 2016. [2015 Impact Factor: 5.58] [Link] Nature Publishing Group

[J19] T. Kozeki, H.-P. Phan, D. V. Dao, S. Inoue, T. Namazu, Influence of gallium ion beam acceleration voltage on the bend angle of amorphous silicon cantilevers, Jpn. J. Appl. Phys., vol. 55, pp. 06GL02, 2016. [Link] [ 2015 Impact Factor: 1.13] 


[J18] T. Dinh, H.-P. Phan, T. Kozeki, A. Qamar, T. Fujii, T. Namazu, N.-T. Nguyen, and D. V. Dao, High thermoresistivity of silicon nanowires induced by amorphization, Mater. Lett., vol. 117, pp. 80-84, 2016. [Link] [ 2015 Impact Factor: 2.5] 


[J17] A. Qamar, H.-P. Phan, T. Dinh, L. Wang, S. Dimitrijev, and D. V. Dao, Piezo-Hall effect in 3C-SiC (100) thin film grown by low pressure chemical vapor deposition (LPCVD), RSC Adv., vol. 6, pp. 31191-31195, 2016.  [2015 Impact Factor: 3.84] 

[J16] D. V. Dao*, H.-P. Phan*,  A. Qamar, and T. Dinh,  Piezoresistive effect of single crystalline 3C-SiC on (111) plane, RSC Adv., vol. 6, pp. 21302-21307, 2016. (* H.-P. Phan and D. V. Dao contributed equally to this work) [2015 Impact Factor: 3.84]


[J15] T. Dinh*, H.-P. Phan*, T. Kozeki, A. Qamar, T. Namazu, N.-T. Nguyen, and D. V. Dao,  Thermoresistive properties of p-type 3C-SiC nanoscale thin films for high temperature MEMS thermal-based sensors, RSC Adv., 2015, 5(128), 106083-106086. (* H.-P. Phan and T. Dinh contributed equally to this work)  [2015 IF: 3.84] [Link]


[J14] A. Qamar, D. V. Dao, J. Han, H.-P. Phan, A. Younis, P. Tanner, T. Dinh, L. Wang, and S. Dimitrijev, Pseudo-Hall effect in single crystal 3C-SiC(111) four-terminal devices, J. Mater. Chem. C, 2015, 3 (48), 12394-12398.   [2015 IF: 4.7]  [Link]


[J13] H.-P. Phan, T. Kozeki, T. Dinh, A. Qamar, Y. Zhu, T. Namazu, N.-T. Nguyen, and D. V. Dao, Piezoresistive effect of p-type silicon nanowires fabricated by a top-down process using FIB implantation and wet etching, RSC Adv., vol. 5, pp. 82121-82126, 2015,  [2015 IF: 3.84] [Link]

[J12] H.-P. Phan, D. V. Dao, K. Nakamura, S. Dimitrijev, and N.-T. Nguyen, The Piezoresistive Effect of SiC for MEMS Sensors at High Temperatures: A Review, JMEMS, vol. 24, no. 6, pp. 1663-1677, 2015.   [2015 IF: 1.754] [Link]

[J11] A. Qamar, H.-P. Phan, J. Han, P. Tanner, T. Dinh, L. Wang, S. Dimitrijev, and D. V. Dao, Effect of device geometries and crystal orientations on the stress-dependent offset voltage of 3C-SiC(100) four terminal devices, J. Mater. Chem. C, 3(34), 2015, pp. 8804 - 8809.    [Link]      [2015 IF: 4.7]

[J10] T. Dinh, H.-P. Phan, D. V. Dao, P. Woodfield, A. Qamar, and N.-T. Nguyen, "Graphite on Paper as Material for Sensitive Thermoresistive Sensors," J. Mater. Chem. C, 2015, 3(34), 8776 - 8779.  [Link]     [2015 IF: 4.7]  Back cover of J.  Mater. Chem. C  [link] (Designer: Hoang-Phuong Phan)


[J9] H.-P. Phan *,  A. Qamar *, D. V. Dao, T. Dinh, L. Wang, J. Han, P. Tanner, S. Dimitrijev, and N.-T. Nguyen, ''Orientation dependence of the pseudo-Hall effect in p-type 3C-SiC four-terminal devices under mechanical stress,'' RSC Advances, 5, 56377-56381, 2015.  (* H.-P. Phan and A. Qamar contributed equally to this work). [Link]    [2015 IF: 3.84]

[J8] T. Dinh, D. V. Dao, H.-P. Phan, L. Wang, A. Qamar, N.-T. Nguyen, P. Tanner, M. Rybachuk, Charge transport and activation energy of amorphous silicon carbide thin film on quartz at elevated temperature, Appl. Phys. Exp., 8, 061303-1, 2015. [Link]     [2015 Impact Factor: 2.4]      Featured in Appl. Phys. Exp. Spotlights 2015       

[J7] A. Qamar *, H.-P. Phan *, D. V. Dao, P. Tanner, T. Dinh, L. Wang, and S. Dimitrijev, The dependence of offset voltage in p-type 3C-SiC Van Der Pauw  device on applied strain, IEEE Electron Device Lett., 36(7), 708-710, 2015. (* A. Qamar and H.-P. Phan contributed equally to this work). [Link]            [2015 IF: 2.8]

[J6] A. Qamar, D. V. Dao, P. Tanner, H.-P. Phan, T. Dinh, and S. Dimitrijev, Influence of External Mechanical Stress on the Electrical Properties of Single Crystal n-3C-SiC/p-Si Heterojunction Diode, Appl. Phys. Exp., 8, 061302-1, 2015.  [Link]           [2015 IF: 2.4]

[J5] H.-P. Phan, D. V. Dao, L. Wang, T. Dinh, N.-T. Nguyen, A. Qamar, P. Tanner, S. Dimitrijev, and Y. Zhu, Strain effect on electrical conductance of p-type nanocrystalline SiC thin film, J. Mater. Chem. C, vol. 3, pp. 1172-1176, 2015. [Link]           [2015 IF: 4.7]



[J4] A. Qamar, P. Tanner, D. V. Dao, H.-P. Phan, and T. Dinh, Electrical Properties of p-type 3C-SiC/Si Heterojunction Diode Under Mechanical Stress, IEEE Electron Device Lett., 35(12), 1293 - 1295, 2014. [Link] [2014 IF: 3.0]

[J3] H.-P. Phan, D. V. Dao, P. Tanner, J. Han, N.-T. Nguyen, S. Dimitrijev, G. Walker, L. Wang, and Y. Zhu, Thickness dependence of the piezoresistive effect in p-type single crystalline 3C-SiC nanothin films, J. Mater. Chem. C, vol. 2, no. 35, pp. 7176-7179, 2014. [Link]    [2014 IF: 6.6]

[J2] H.-P. Phan, D. V. Dao, P. Tanner, L. Wang, N.-T. Nguyen, Y. Zhu, S. Dimitrijev, Fundamental piezoresistive coefficients of p-type single crystalline 3C-SiC, Appl. Phys. Lett., 104(11), 111905, 2014. [Link] [2014 IF: 3.5]

[J1] H.-P. Phan, P. Tanner, D. V. Dao, L. Wang, N.-T. Nguyen, Y. Zhu, S. Dimitrijev, Piezoresistive Effect of p-Type Single Crystalline 3C-SiC Thin Film, IEEE Electron Device Lett., 35(3), 399-401, 2014. [Link] [2014 IF: 3.0]

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Our research group are grateful to the generous support from the following  funding agencies: