Conference proceedings

[C24] T. Dinh, et al., "Flexible and wearable flow sensor using spinnable carbon nanotube nanofilm for respiration monitoring", IEEE MEMS conf., Vancouver, Canada, 2020.


[C23] V.T. Nguyen, et al., "Optoelectronic enhancement for piezoresistive pressure sensor", IEEE MEMS conf., Vancouver, Canada, 2020.


[C22] V.T. Nguyen, T. Dinh, T.-K. Nguyen, R.A. Md. Foisal, H.-P. Phan, N.-T. Nguyen, D.V. Dao, "Ultra sensitive opto-piezoresistive sensors utilizing 3C-SiC/Si heterostructure", TRANSDUCERS, Berlin, Germany, 2019.


[C21] F. Lenzini, J. Janousek, O. Thearle, M. Villa, B. Haylock, S. Kasture, L. Cui, H.-P. Phan, D. V. Dao, H. Yonezawa, P. K. Lam, E. H. Huntington, M. Lobino, "Continuous Variable quantum optics on-chip", The International Conference on Integrated Quantum Photonics, 2018, Paris, France, 2018.


[C20] C.A. Chaplin, K.M. Dowling, H.-P. Phan, R. Chen, and D.G. Senesky, " Temperature-dependent transient behavior  of AlGaN/GaN high electron mobility pressure sensors", Hilton Head Workshop, 2018, SC, USA 2018.


[C19] T.K. Nguyen, H.-P. Phan, T. Dinh, A. R. Md. Foisal, J. Han, Y. Zhu, N.-T. Nguyen, and D. V. Dao, "Utilizing large hall offset voltage for conversion free 4H-SiC strain sensor, " IEEE Int. Conf. Micro Electro Mechanical Systems (MEMS) 2018, Belfast, North Ireland, pp. 882-885, 2018.


[C18] T.K. Nguyen, H.-P. Phan, T. Dinh,  N.-T. Nguyen, and D. V. Dao, "Ultra-thin LPCVD silicon carbide membrane: A promising platform for bio-cell culturing," IEEE Int. Conf. Micro Electro Mechanical Systems (MEMS) 2018, Belfast, North Ireland, pp. 344-347, 2018. 


[C17] T. Dinh, T.K. Nguyen, H.-P. Phan, F.-W. Jarred, C.-D. Tran, N.-T. Nguyen, and D. V. Dao, "Fabrication of a Sensitive Pressure Sensor Using Carbon Nanotube Micro-Yarns," IEEE Sensors Conference 2017, Scotland, UK, 2017. 


[C16] T. Dinh, H.-P. Phan, A. Qamar, T.K. Nguyen, P. Woodfield, Y. Zhu, N.-T. Nguyen, and D. V. Dao, "Sensitive and Fast Response Graphite Pressure Sensor Fabricated by a Solvent-Free Approach" IEEE Sensors Conference 2017, Scotland, UK, Oct. 2017.


[C15] T. Dinh, H.-P. Phan, T.K Nguyen, F.-W. Jarred, A.R. M. Foisal, W. Lafta, N.-T. Nguyen, and D. V. Dao, "Environment-friendly wearable thermal flow sensors for noninvasive respiratory monitoring," IEEE Int. Conf. Micro Electro Mechanical Systems (MEMS) 2017, Las Vegas, USA, 993-996, Jan. 2017. [Link]


[C14] A. Qamar, T. Sarwar, T. Dinh, A.R.M. Foisal, H.-P. Phan, D.V. Dao, "Pseudo-Hall Effect in Graphite on Paper Based Four Terminal Devices for Stress Sensing Applications", J. Phys.: Conf. Ser., 829, 012004, 2017. [Link]


[C13] A. Qamar, D. V. Dao, J. Han, A. Iacopi, T. Dinh, H.-P. Phan, S. Dimitrijev, "Pseudo-hall Effect in single crytal n-type 3C-siC(100) thin film", Int. Conf. on Material Technologies in Modern Industrial Production, Key Eng. Mater., Vol. 733, pp. 3-7, 2017. [Link]


[C12] T. Dinh, H.-P. Phan, T. Kozeki, A. Qamar, T. Namazu, Y. Zhu, N.-T. Nguyen, and D. V. Dao, "Design and fabrication of electrothermal SiC nanoresonators for high-resolution nanoparticle sensing," IEEE Nano 2016, August, 2016.


[C11] A. Qamar, D. V. Dao, J. Han, I. Iacopi, T. Dinh, H.-P. Phan, and S. Dimitrijev, "Pseudo-Hall effect in single crystal n-type SiC (100) thin films," ICNNE 2016, Parsis, France, June, 2016.


[C10] H.-P. Phan, T. Kozeki, T. Dinh, G. Ina, A. Qamar, T. Namazu, N.-T. Nguyen, and D. V. Dao, "Temperature dependence of the electrical conductance in p-type 3C-SiC thin films transferred on glass substrate using FIB," 28th Int. Conf. Microprocesses & Nanotechnology (MNC 2015), Toyama, Japan, November, 2015. 


[C9] H.-P. Phan, D. V. Dao, T. Dinh, H. Brooke, A. Qamar, N.-T. Nguyen, and Y. Zhu, "Graphite-on-paper based tactile sensor using plastic laminating technique," The 28th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS '15), Estoril, Portugal, pp. 825-828, 2015. [Link]


[C8] Dinh H.-G., Nguyen T.-V., K. Noda, Phan H.-P., Nguyen B.-K., T. Takahata, K. Matsumoto, I. Shimoyama, "Micro liquid-based thermo-acoustic transmitter for emitting ultrasound in liquid medium," The 27th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS '14), San Francisco, USA, pp. 765-768. [Link]

[C7] Pham Q.-K., Nguyen M.-D., Nguyen B.-K., H.-P. Phan, K. Matsumoto, I. Shimoyama, "Multi-axis force sensor with dynamic range up to ultrasonic," The 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS '14), San Francisco, USA, pp. 769-772. [Link]

[C6] Nguyen M.-D., Phan H.-P., K. Matsumoto and I. Shimoyama , "A hydrophone using liquid to bridge the gap of a piezoresistive," Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2013, Barcelona, Spain, pp. 70-73. [Link] (Nguyen M. D. and H.-P. Phan contributed equally to this work)

[C5] Nguyen M.-D, Phan H.-P., K. Matsumoto and I. Shimoyama, "A Sensitive Liquid-Cantilever Diaphragm For Pressure Sensor," The 26th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS '13), Taipei, Taiwan, 20-24 January, 2013, pp. 617-620. [Link]

[C4] Phan H. P., K. Matsumoto, and I. Shimoyama, “Lateral accelerometer based on sub-micron standing piezoresistive cantilever with thick photoresist proof mass,” The 6th IEEE Asia-Pacific Conference on Transducers and Micro/Nano Technologies (APCOT 2013), Nanjing, China, 8-11 July, 2012. [Link] [pdf]

[C3] Phan H.-P., H. Kaminaga, H. Tanaka, Y. Nakamura., "Sensors feedback control of electro-hydrostatic actuator power assist device based on phases of human gait using emg signal and velocity positive feedback," JSME Robotics and Mechatronics Conference 2011, pp. 2A1-E08 (1)-(3). [In Japanese] [Link]

[C2] H. Tanaka, H. Kaminaga, Phan H.-P., Y. Nakamura, "Power assist control of exoskeletal hydrostatic robot based on singular perturbation control using pressure feedback," JSME Robotics and Mechatronics Conference 2011, pp. 2P1-F03 (1)-(4). [In Japanese] [Link]

[C1] H. Kaminaga, Phan H.-P., H. Tanaka, Y. Nakamura, "Power augmenting control of knee power assist device using sensitivity maximization with supplemental usage of surface EMG signal," JSME Robotics and Mechatronics Conference 2011, pp. 2P2-F02 (1)-(4). [In Japanese] [Link]

Our research group are grateful to the generous support from the following  funding agencies: